Description

The Elite Etch-Cu from RKD Engineering is an
Automated Mixed Acid Decapsulator, with advanced feature integration to enable high productivity. This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage. The delivery of each microaliquoh is done with sufficient pressure to create extreme turbulence in the etched cavity that greatly accelerates the rate of encapsulate removal. Very low, precise acid temperatures, combined with high micro-aliquot delivery rates allow for the decapsulation of copper wired devices with no wire or metallization damage. An exclusive acid delivery function can be selected that delivers the highest pulse rate possible while consuming less than maximum acid volume. The specially designed acid heat exchanger can accurately control acid temperature down to 15oC and up to 250oC, with flow rates to 8 ml. per minute. The high acid pulse rates achieve reasonable etch times even at the lowest temperatures. The Elite Etch operates at temperatures up to 250oC enabling operational versatility with any combination of acids.