Description

Large die back side thinning with minimal thickness variation 

The UltraPrep II is designed to perform in package
die thinning and polishing along with special
machining functions for sample preparation. The
die thinned and polished by the UltraPrep are
suited to all back side procedures because of the
near uniform finished silicon thickness. It can
also perform removal of heat spreaders and heat
sinks, and the removal of plastic and die attach
material to expose the die in plastic packages. It
provides an easy to use solution for total backside
device preparation. The UltraPrep is a small,
specially designed, CNC machining system
controlled by a graphic user interface that allows
for the operator to select the desired function and
enter the key device measurements.

Automatic tool touch-down and profiling
functions coupled with video alignment make
setting up on a device fast and easy. There is no
need to level the device as the UltraPrep will
accurately profile the die surface and then move
the tool according to the stored surface contour.
This allows for thickness uniformity on die that
are not flat or warped.